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Publication description

Głuszko, Grzegorz; Łukasiak, Lidia; Kilchytska, Valeriya; Chung, Tsung Ming; Olbrechts, Benoit; Flandre, Denis, Charge-pumping characterization of SOI devices fabricated by means of wafer bonding over pre-patterned cavities, Journal of Telecommunications and Information Technology, 2007, nr 3

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